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HNU, Wuxi to Co-build Semiconductor Advanced Manufacturing Research Institute

An agreement of establishing the HNU-Wuxi Semiconductor Advanced Manufacturing Research Institute was inked in Wuxi, Jiangsu Province, on April 12, 2021.

Huang Qin, secretary of the CPC Wuxi Municipal Committee, Duan Xianzhong, HNU president, and Ding Rongjun, an academician of the Chinese Academy of Engineering and also dean of HNU College of Mechanical and Vehicle Engineering, attended the ceremony and held discussion.

Other leaders present included Bai Changling, CPC Wuxi Municipal Committee Standing Committee member, Organization Department director, and United Front Work Department director; Gao Yaguang, Wuxi vice mayor; and, Li Kengli, HNU assistant president.



The research institute will be co-built by HNU and the People’s Government of Xishan District, Wuxi. The project will be led by academician Ding Rongjun, and undertaken by the National Xishan Economic and Technological Development Zone.

Centering on Wuxi’s high-end manufacturing and scientific innovation development, it will leverage HNU’s advantages in the “double first-class” disciplines and the platform of the state engineering and technological center for semiconductor advanced manufacturing, and focus on core applied technology of semiconductor advanced manufacturing. It will be built into a worldly influential institute for semiconductor advanced manufacturing which integrates scientific research and development, technological innovation, public service, talent cultivation, and research outcome transformation.


An innovation center for technological R&D and industrialization will be set up to promote integration of semiconductor advanced manufacturing and related cutting-edge technologies, including semiconductor wafer laser manufacturing; semiconductor wafer ultra-precision manufacturing; semiconductor optic components and parts micro and nano-fabrication; semiconductor testing; ultra-precision functional component manufacturing; power semiconductor device and application. It will break through the bottleneck of key system and equipment technologies.

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